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§ Private Profile · Santa Clara, CA, USA
Semiconductor technology company developing and licensing die-to-die (D2D) interconnect PHY for chiplet manufacturers, supporting BoW and UCIe.
Eliyan develops die-to-die interconnect technology for chiplets that enables high-bandwidth, low-latency semiconductor connections for advanced packaging applications. The company licenses its NuLink PHY solution to semiconductor manufacturers, supporting industry-standard interconnects such as Bunch of Wires and Universal Chiplet Interface Express alongside proprietary simultaneous bidirectional solutions. The enterprise recently completed a tape-out utilizing TSMC's 5nm process, with initial silicon products scheduled to reach the commercial market during the second quarter of 2023. Eliyan has secured over $100 million in total venture capital funding, including a $40 million Series A financing round backed by strategic investors such as Intel, Micron, Samsung, and SK Hynix. The underlying technology development originally commenced in 2016 to address the growing bandwidth requirements of modern system-on-chip hardware designs. Eliyan was officially founded in 2021 by Ramin Farjadrad, Syrus Ziai, and Patrick Soheili.
Eliyan has raised $150.0M across 3 funding rounds.
Eliyan has raised $150.0M in total across 3 funding rounds.
Eliyan is a semiconductor company specializing in die-to-die (D2D) interconnect technology for chiplet-based systems, enabling super-large System-in-Packages (SiPs) with high bandwidth and power efficiency.[1][2][3] Its flagship product, NuLink, is a PHY technology supporting industry standards like Bunch of Wires (BoW) and Universal Chiplet Interface Express (UCIe), delivering up to 4x the bandwidth and 2x the power efficiency of alternatives, while serving AI data centers, high-bandwidth memory (HBM), and Gen AI subsystems by breaking memory and I/O bottlenecks.[2][3][4] Recently recognized in the EE Times Silicon 100 for 2025, Eliyan shows strong growth momentum through partnerships with Arm Total Design, Open Compute Project (OCP), and major foundries, alongside advancements like 64Gbps PHY in 3nm processes.[4]
Eliyan was founded in 2021 in Santa Clara, California, as a spin-out from Aquantia (acquired by Marvell in 2019), carrying over 6+ years of research and production on D2D technology.[1][2][5] CEO and Founder Ramin Farjadrad, a networking pioneer, developed the breakthrough interconnect architecture in 2016 while at Aquantia, leveraging cross-technology innovations for superior bandwidth, low latency, and efficiency.[2][3] This architecture gained traction with OCP adoption as BoW standard in 2022, evolving into UCIe support amid the chiplet shift beyond Moore's Law, with early patents (17 filed, focusing on computer memory and semiconductor fabrication) marking pivotal validation.[1][2]
Eliyan rides the chiplet revolution, transitioning from monolithic dies to modular chiplets for AI-driven data centers, where interconnects are critical amid slowing Moore's Law and surging Gen AI demands.[2][4] Timing aligns with 2022 UCIe standardization and OCP expansions (e.g., Oct 2025 announcements), fueled by market forces like HBM shortages and need for open ecosystems over proprietary stacks.[1][4][5] By enabling massive SiPs and memory pooling, Eliyan influences the ecosystem toward a "general marketplace" for chiplets, accelerating AI performance while cutting costs—positioning it as a key enabler alongside Arm and foundries.[2][4]
Eliyan is poised to dominate chiplet interconnects as AI sub-systems scale, with NuLink-X expansions targeting C2C and memory innovations showcased at OCP Global Summit 2025.[4] Trends like open chiplet economies (UCIe/OCP growth) and 3nm+ processes will amplify its edge, potentially capturing share in data center TCO savings amid HBM evolution.[1][2][4] Influence may evolve through deeper Arm/OCP integrations and Dutch ecosystem entry, solidifying its role in the "ultimate chiplet interconnect" for next-gen AI—building directly on its high-bandwidth origins to power the post-Moore era.[3][4][5]
Eliyan has raised $150.0M across 3 funding rounds. Most recently, it raised $50.0M Venture Round in January 2026.
| Date | Round | Lead Investors | Other Investors | Status |
|---|---|---|---|---|
| Jan 28, 2026 | $50M Venture Round | — | ARM Holdings, Coherent, Intel Capital, Meta Platforms, Samsung Catalyst Fund, AMD Ventures, Mohamed Awad | Announced |
| Mar 1, 2024 | $60M Series B | Marco Chisari, Tiger Global | Ehukai Investments, Intel Capital, Cleveland Avenue, Mesh Ventures, SK Hynix | Announced |
| Nov 8, 2022 | $40M Series A | — | Celesta Capital, Cerberus Capital Management, Intel, Micron Ventures, Shaygan Kheradpir | Announced |
Eliyan has raised $150.0M in total across 3 funding rounds.
Eliyan's investors include Arm Holdings, Coherent, Intel Capital, Meta, Samsung Catalyst Fund, AMD Ventures, Mohamed Awad, Marco Chisari, Tiger Global, Ehukai Investments, Cleveland Avenue, Mesh Ventures.